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Wafer Heating Device

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Wafer Heating Device


In cold and hot stage applications, products related to temperature control technology, in-situ mechanical technology, and others—such as wafer heating systems, rapid annealing furnaces, and high-low temperature test chambers—can be customized to meet specific client requirements.


The GoGo Instruments  Wafer Heating Device:It plays a critical role in semiconductor processing, particularly in key steps such as wafer annealing, bonding, photoresist coating, etching, and chemical vapor deposition. It delivers a stable thermal environment and highly uniform temperature distribution across the platen, meeting precise heating requirements across various temperature zones to support both manufacturing and R&D of semiconductor devices.



• Temperature range:RT~600°C

• Temperature stability: ±0.1°C

•  Material:Aluminum alloy, stainless steel, Invar®, etc.

• High-Precision Temperature Control

• Professional Temperature Control Software

• Customization available

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