In cold and hot stage applications, products related to temperature control technology, in-situ mechanical technology, and others—such as wafer heating systems, rapid annealing furnaces, and high-low temperature test chambers—can be customized to meet specific client requirements.

The GoGo Instruments  RTP600：The rapid annealing furnace is specifically designed for high-temperature semiconductor processing. It supports oxidation, diffusion, and rapid annealing processes within a temperature range of 500 °C to 1000 °C. Equipped with a dual-layer array of 21 × 1 kW high-power lamps, it achieves an ultra-fast heating rate of 150 °C/s. A water-cooled aluminum chamber and quartz inner liner ensure excellent temperature uniformity. The system is compatible with 2- to 6-inch wafers and offers an efficient solution integrated with precise gas control.