I. Test Introduction

Solder ball shear testing is a critical method for evaluating the connection reliability of solder ball joints (e.g., BGA, CSP) in electronic packaging. The principle involves applying precise shear forces to solder ball joints using a bond tester (simulating stress scenarios during manufacturing, inspection, transportation, and use) and assessing connection reliability by observing changes in key performance indicators.

Traditional solder ball shear testing is limited to room temperature. This test integrates GoGo Instruments' custom heating/cooling stage into the system, enabling shear force testing under variable temperatures. This approach simulates extreme high/low-temperature conditions to evaluate the connection strength of solder ball joints.

II. System Configuration

Bond Tester:

A bond tester is a physical performance testing instrument used in mechanical characterization. It features high-precision load sensors and displacement control systems, supporting tests such as die shear, ball shear, and wire pull. Its simulator ensures high accuracy for precise measurements and mechanical analysis of micro-scale joints.

GoGo Instruments' Custom Heating/Cooling Stage:

Provides stable extreme temperature environments for solder ball shear testing.

Utilizes liquid nitrogen cooling and resistive heating for precise temperature control within -55°C to 300°C.Equipped with professional temperature control software supporting rapid point-to-point temperature changes, fixed ramp rates, and automated programmable temperature profiles.

Features an air curtain structure to prevent condensation/frost formation on the stage and test area during low-temperature testing in open-atmosphere conditions.

↑ GoGo Instruments Customized Heating/Cooling Stage ↑

III. Test Procedure

1. Sample Preparation:

Select chip or circuit board samples with typical solder ball joint structures (e.g., BGA, CSP), ensuring welding quality meets standards.

Secure samples onto the stage using built-in fixtures.

2. Equipment Setup and Calibration:

Install the custom heating/cooling stage (with fixed samples) onto the bond tester.

Adjust tester parameters (e.g., test speed, initial position).

3. Temperature Stabilization and Testing:

Initiate shear testing after temperature stabilization.

Activate the bond tester to apply shear force to solder balls according to predefined programs. Record and analyze load-displacement curves to extract shear force data at each temperature.

4. Data Analysis and Evaluation:

Statistically analyze data to compare shear strength of solder ball joints across temperatures.

Evaluate performance changes under extreme temperatures to assess reliability and stability.

By integrating GoGo Instruments' custom heating/cooling stage with the bond tester, this test achieves comprehensive evaluation of solder ball joint quality and reliability under extreme low/high-temperature conditions. The collected data provides valuable insights for electronic device manufacturers, supporting optimization of welding processes and refinement of device designs. This approach enhances performance stability in complex working environments and significantly improves device reliability.