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Three-dimensional Digital Image Correlation (DIC) is widely used for strain measurement due to its accuracy, robustness, and ease of use. However, when measuring samples that require high magnification, 3D measurements still struggle to meet requirements. This is primarily because 3D systems lack optical components with sufficient depth of field to capture two highly magnified images from different perspectives, which are essential for 3D analysis. DIC-Micro addresses the limitations of traditional equipment in measuring deformation of Micro-objects, making it a powerful tool for deformation and strain measurement at the micro-scale.
The DIC-Micro microscopic measurement system—combining optical microscopy with DIC technology—enables nanoscale precision measurements.
1. Acquires full-field 3D coordinates, displacement, and strain data.
2. 3D visualization of measurement results.
3. Applicable to any material.
4. Fast, simple, and high-precision system calibration.
5. Adjustable measurement area: covers a range from 1 mm to 10 mm.
6. Strain measurement range: from a minimum of 0.01% to over 500%.
7. Flexible and user-friendly triggering function.
1. Micro-scale topography and strain analysis (micron-level and nano-level)
2. Material testing (determination of Young's modulus, Poisson's ratio, and elastic-plastic properties)
3. Strain calculation, elasticity evaluation, component dimension measurement, and detection of nonlinear changes
4. Testing of advanced materials (e.g., CFRP, wood, PE-reinforced fibers, metal foam, rubber)
5. Behavior analysis of homogeneous and heterogeneous materials during deformation
6. Characterization of isotropic and anisotropic deformation properties
7. Component testing (displacement and strain measurement)
8. Micro-scale dynamic strain measurement, such as fatigue tests
9. Biomechanics (e.g., bones, muscles, blood vessels)
10. Fracture mechanics performance
11. Detection of nonlinear deformation
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