Channel Configuration and Connection Methods:

• 12 multi-pin aviation connectors: Connected via junction box, enabling stable connections for multi-pin devices, ideal for samples with dense pin layouts and compact designs.

• 2 SMA interfaces: Suitable for high-frequency signals or low-noise measurement requirements, enhancing testing flexibility and signal integrity.

• Terminal block connections for all channels: Ensures reliable contact and allows users to quickly install or replace samples.

Chamber Design and Process Features:

• Specialized vacuum chamber process: Optimized sealing structure and material treatment significantly improve vacuum retention performance.

• Highly compatible sample space: Supports customized sample stage layouts, adapting to various device sizes and electrode configurations.

Typical Application Scenarios:

• Electrical property testing of semiconductor materials

• Variable-temperature I-V and C-V measurements of micro-nano devices

• Device reliability evaluation under low/high temperature environments

• Parallel electrical characterization of samples with multi-electrode complex structures

On-site 

Main Technical Specifications:

• Cooling/Heating Method: Liquid nitrogen cooling, resistance heating

• Temperature Range: -190°C to 400°C

• Temperature Stability: ±0.1°C (±0.3°C from -120°C to 190°C)

• Temperature Control Rate: Max heating rate: 150°C/min, Max cooling rate: 40°C/min

• Sample Stage: Silver material; 23mm * 23mm

• Optical Path: Reflection

• Window Size: φ25mm

• Window Material: JGS2 quartz glass (transmission band range 220nm ~ 2500nm), manually detachable and replaceable

• Distance from Window Top Surface to Sample Top Surface: 7mm

• Sample Chamber Height: 6mm

• Window Defrosting: Gas purging for defrosting at low temperatures

• Chamber: Vacuum

• 14 Binding Posts, including 12 pins and 2 connected to SMA interfaces